Compaq ProLiant DL388e Guide de l'utilisateur Page 110
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Specifications 110
Specifications
Environmental specifications
Specification Value
Temperature range*
Operating
10
°
C to 35
°
C (50
°
F to 95
°
F)
Shipping
-30°C to 50°C (-22°F to 122°F)
Storage
-30°C to 60°C (-22°F to 140°F)
Maximum wet bulb
temperature
28°C (82.4°F)
Relative humidity
(noncondensing)**
Operating
10% to 90%
Non-operating
5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048
m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for
storage corresponds to a pressure minimum of 70 KPa.
Mechanical specifications
Specification Value
Dimensions
Height
8.59 cm (3.38 in)
Depth
66.07 cm (26.01 in)
Width
44.54 cm (17.54 in)
Weight (maximum)
27.2 kg (60.0 lb)
Weight (no drives installed)
20.4 kg (47.2 lb)
Power supply specifications
Depending on installed options, the server is configured with one of the following power supplies:
• HP ProLiant 1200 W Power Supply
Specification Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
- HP ProLiant DL388 G7 Server 1
- User Guide 1
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- Front panel LEDs and buttons 8
- Systems Insight Display LEDs 9
- Rear panel components 11
- Rear panel LEDs and buttons 12
- System board components 14
- System maintenance switch 15
- NMI functionality 15
- DIMM slot locations 16
- SAS and SATA device numbers 17
- SAS and SATA hard drive LEDs 18
- PCI riser cage LEDs 19
- FBWC module LEDs 20
- Battery pack LEDs 21
- Hot-plug fans 22
- Component identification 23 23
- Operations 24
- Remove the access panel 25
- Install the access panel 26
- Remove the PCI riser cage 29
- Install the PCI riser cage 29
- Remove the air baffle 31
- Rack planning resources 32
- Optimum environment 33
- Temperature requirements 34
- Power requirements 34
- Rack warnings 35
- Installing hardware options 35
- Setup 37 37
- Registering the server 38
- Introduction 39
- Processor option 39
- Install the heatsink 44
- Memory options 46
- DIMM identification 47
- Memory configurations 47
- Installing a DIMM 53
- Optical drive option 57
- Expansion board options 60
- PCI riser board option 63
- Hard drive cage option 64
- Cabling 69
- BBWC battery cabling 70
- FBWC battery cabling 70
- Configuration and utilities 71
- HP ROM-Based Setup Utility 72
- Boot options 73
- BIOS Serial Console 73
- Configuring AMP modes 73
- Configuring mirrored memory 74
- Array Configuration Utility 75
- Management tools 76
- ROMPaq utility 77
- Erase Utility 77
- Redundant ROM support 78
- Diagnostic tools 79
- Keeping the system current 80
- Version control 81
- ProLiant Support Packs 81
- Firmware 82
- HP Smart Update Manager 82
- Care Pack 83
- Troubleshooting 84
- Symbols on equipment 85
- Warnings 85
- Symptom information 86
- Troubleshooting 87 87
- Loose connections 88
- Service notifications 88
- Server health LEDs 88
- Troubleshooting flowcharts 88
- Start diagnosis flowchart 89
- General diagnosis flowchart 90
- Symptoms: 92
- POST problems flowchart 94
- OS boot problems flowchart 96
- • Corrupted OS 97
- • Redundancy failure 99
- (http://www.hp.com/support) 100
- Troubleshooting 101 101
- Battery replacement 102
- FCC rating label 103
- Class A equipment 103
- Class B equipment 103
- Modifications 104
- • EMC Directive 2004/108/EC 105
- Japanese notice 106
- BSMI notice 106
- Korean notice 106
- Chinese notice 107
- Laser compliance 107
- Battery replacement notice 107
- Electrostatic discharge 109
- Specifications 110
- Technical support 113
- Technical support 114 114
- Customer Self Repair 115
- Technical support 116 116
- Reparo feito pelo cliente 117
- Technical support 118 118
- Technical support 119 119
- Technical support 120 120
- Acronyms and abbreviations 121
- Index 124 124
- Index 125 125
- Index 126 126
- Index 127 127
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